Micro Nano Devices, Structure and Computing Systems II
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Bester Preis: Fr. 155.90 ( 159.42)¹ (vom 28.11.2021)
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9783038260233 - De Huai Zeng: Micro Nano Devices, Structure and Computing Systems II
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De Huai Zeng

Micro Nano Devices, Structure and Computing Systems II (2013)

Lieferung erfolgt aus/von: Deutschland DE NW EB DL

ISBN: 9783038260233 bzw. 3038260231, in Deutsch, Trans Tech Publications, neu, E-Book, elektronischer Download.

Fr. 325.72 ( 333.08)¹
versandkostenfrei, unverbindlich
Lieferung aus: Deutschland, Versandkostenfrei.
Micro Nano Devices, Structure and Computing Systems II: Selected, peer reviewed papers from the 2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2013), January 23-24, 2013, Shenzhen, China. The papers are grouped as follows: Chapter 1: Nanomaterials, Nanostructure and Nano Technologies Chapter 2: Nano and Micro Devices and Systems Chapter 3: Material Science and Engineering Chapter 4: Machine Parts and Mechanisms Chapter 5: Microelectronics and Electronics. Circuits and Systems Chapter 6: Techniques of Measuring and Modeling Chapter 7: Control, Communication and Information Technologies Chapter 8: Engineering Management and Education. Englisch, Ebook.
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9783038260233 - Micro Nano Devices, Structure and Computing Systems II

Micro Nano Devices, Structure and Computing Systems II (2013)

Lieferung erfolgt aus/von: Vereinigte Staaten von Amerika EN NW EB DL

ISBN: 9783038260233 bzw. 3038260231, in Englisch, neu, E-Book, elektronischer Download.

Fr. 156.44 (C$ 230.32)¹
versandkostenfrei, unverbindlich
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
Selected, peer reviewed papers from the 2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2013), January 23-24, 2013, Shenzhen, China. The papers are grouped as follows: Chapter 1: Nanomaterials, Nanostructure and Nano Technologies; Chapter 2: Nano and Micro Devices and Systems;Chapter 3: Material Science and Engineering;Chapter 4: Machine Parts and Mechanisms;Chapter 5: Microelectronics and Electronics. Circuits and Systems; Chapter 6: Techniques of Measuring and Modeling; Chapter 7: Control, Communication and Information Technologies; Chapter 8: Engineering Management and Education.
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