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Wafer Bonding: Applications and Technology (Springer Series in Materials Science)
11 Angebote vergleichen
Preise | Feb. 18 | Apr. 19 | Okt. 19 |
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Schnitt | Fr. 0.00 (€ 0.00)¹ | Fr. 183.65 (€ 187.19)¹ | Fr. 160.29 (€ 163.38)¹ |
Nachfrage |
Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (2011)
ISBN: 9783642059155 bzw. 3642059155, in Englisch, 504 Seiten, Springer, Taschenbuch, neu, Nachdruck.
Ново от: $277.69 (11 Оферти)
Използван от: $289.87 (5 Оферти)
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Von Händler/Antiquariat, Amazon.com.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Paperback, Издание: Softcover reprint of the original 1st ed. 2004, Етикет: Springer, Springer, Продуктова група: Book, Публикувани: 2011-09-30, Студио: Springer, Продажбата ранг: 11924741.
Wafer Bonding
ISBN: 9783662108277 bzw. 3662108275, vermutlich in Englisch, Springer Shop, neu, E-Book, elektronischer Download.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. eBook.
Wafer Bonding - Applications and Technology
ISBN: 9783662108277 bzw. 3662108275, vermutlich in Englisch, Springer Berlin Heidelberg, neu, E-Book, elektronischer Download.
Wafer Bonding: During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Englisch, Ebook.
Wafer Bonding
ISBN: 9783662108277 bzw. 3662108275, in Englisch, neu, E-Book, elektronischer Download.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (2013)
ISBN: 9783662108277 bzw. 3662108275, in Englisch, 499 Seiten, 2004. Ausgabe, Springer, neu, E-Book, elektronischer Download.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Kindle Edition, Ausgabe: 2004, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2013-03-09, Freigegeben: 2013-03-09, Studio: Springer.
Wafer Bonding
ISBN: 9783642059155 bzw. 3642059155, in Englisch, Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Taschenbuch, neu.
Wafer Bonding: Applications and Technology (Springer Series in Materials Science
ISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, neu.
Von Händler/Antiquariat, ausreseller - AusReseller.
Фиксирана цена.
NEW Wafer Bonding BOOK (Paperback) Free P&H
ISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, Taschenbuch, neu.
Von Händler/Antiquariat, grey_elk_books_au_and_uk - Grey Elk Books.
Фиксирана цена.