Wafer Bonding: Applications and Technology (Springer Series in Materials Science)
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| Preise | 2012 | 2013 | 2014 | 2015 | 2017 |
|---|---|---|---|---|---|
| Schnitt | Fr. 204.68 (€ 209.31)¹ | Fr. 252.25 (€ 257.96)¹ | Fr. 269.98 (€ 276.08)¹ | Fr. 340.02 (€ 347.70)¹ | Fr. 283.75 (€ 290.17)¹ |
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1
Wafer Bonding: Applications and Technology (Springer Series in Materials Science) (2011)
EN PB NW RPISBN: 9783642059155 bzw. 3642059155, in Englisch, 504 Seiten, Springer, Taschenbuch, neu, Nachdruck.
Ново от: $277.69 (11 Оферти)
Използван от: $289.87 (5 Оферти)
Покажи още 16 Оферти в Amazon.com
Lieferung aus: Vereinigte Staaten von Amerika, Usually ships in 24 hours.
Von Händler/Antiquariat, Amazon.com.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Paperback, Издание: Softcover reprint of the original 1st ed. 2004, Етикет: Springer, Springer, Продуктова група: Book, Публикувани: 2011-09-30, Студио: Springer, Продажбата ранг: 11924741.
Von Händler/Antiquariat, Amazon.com.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information., Paperback, Издание: Softcover reprint of the original 1st ed. 2004, Етикет: Springer, Springer, Продуктова група: Book, Публикувани: 2011-09-30, Студио: Springer, Продажбата ранг: 11924741.
2
Wafer Bonding
EN PB NWISBN: 9783642059155 bzw. 3642059155, in Englisch, Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Taschenbuch, neu.
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
3
Wafer Bonding: Applications and Technology (Springer Series in Materials Science
DE NWISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, neu.
Lieferung aus: Australien, Тип доставка: Flat, Доставка: Australien, Америка, Европа, Континентална Азия, Neuseeland, Оферта местоположение: 2114 Australia.
Von Händler/Antiquariat, ausreseller - AusReseller.
Фиксирана цена.
Von Händler/Antiquariat, ausreseller - AusReseller.
Фиксирана цена.
4
NEW Wafer Bonding BOOK (Paperback) Free P&H
DE PB NWISBN: 9783642059155 bzw. 3642059155, in Deutsch, Springer, Berlin/Heidelberg/New York, NY, Deutschland, Taschenbuch, neu.
Lieferung aus: Vereinigte Staaten von Amerika, Тип доставка: Free, Доставка: Европа, Оферта местоположение: USA, Безплатна доставка.
Von Händler/Antiquariat, grey_elk_books_au_and_uk - Grey Elk Books.
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Von Händler/Antiquariat, grey_elk_books_au_and_uk - Grey Elk Books.
Фиксирана цена.
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