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100%: Ultra Clean Processing of Silicon Surfaces VI (ISBN: 9783035707205) in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
82%: Ultra Clean Processing of Silicon Surfaces V (ISBN: 9783035707007) in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
82%: Ultra Clean Processing of Silicon Surfaces IV (ISBN: 9783035706833) in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
Ultra Clean Processing of Silicon Surfaces VI - 3 Angebote vergleichen
Bester Preis: Fr. 151.09 (€ 154.30)¹ (vom 01.12.2021)1
Ultra Clean Processing of Silicon Surfaces VI
EN NW EB DLISBN: 9783035707205 bzw. 3035707200, in Englisch, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing. Volume is indexed by Thomson Reuters CPCI-S (WoS).This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).
The issues addressed by the Sixth International Symposium on the Ultra Clean Processing of Silicon Surfaces included all aspects of ultra-clean Si-technology, cleaning and contamination control in both front-end-of-line (FEOL) and back-end-of-line (BEOL) processing. Volume is indexed by Thomson Reuters CPCI-S (WoS).This covered studies of Si-surface chemistry and topography and its relationship to device performance and process yield, cleaning in relationship to new gate stacks, cleaning at the interconnect level, resist stripping and polymer removal, cleaning and contamination control of various new materials, wafer backside cleaning and cleaning following Chemical-Mechanical-Polishing (CMP).
2
Ultra Clean Processing of Silicon Surfaces V
EN NW EB DLISBN: 9783035707007 bzw. 3035707006, in Englisch, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
Volume is indexed by Thomson Reuters CPCI-S (WoS).The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
Volume is indexed by Thomson Reuters CPCI-S (WoS).The proceedings of the Fifth International Symposium on Ultra Clean Processing of Silicon Surfaces cover all aspects of ultra-clean Si-technology: cleaning, contamination control, Si-surface chemistry and topography, and its relationship to device performance and process yield. New areas of concern include: cleaning at the interconnect level, resist strip and polymer removal (dry and wet), cleaning and contamination aspects of metallization, wafer backside cleaning and cleaning after Chemical-Mechanical-Polishing (CMP).
3
Ultra Clean Processing of Silicon Surfaces IV
EN NW EB DLISBN: 9783035706833 bzw. 3035706832, in Englisch, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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