Von dem Buch CMOS Cantilever Sensor Systems haben wir 3 gleiche oder sehr ähnliche Ausgaben identifiziert!
Falls Sie nur an einem bestimmten Exempar interessiert sind, können Sie aus der folgenden Liste jenes wählen, an dem Sie interessiert sind:
100%: H. Baltes/ O. Brand/ D. Lange: CMOS Cantilever Sensor Systems (ISBN: 9783662050606) 2013, Springer Berlin Heidelberg, Springer Berlin Heidelberg, in Englisch, auch als eBook.Nur diese Ausgabe anzeigen…
75%: Lange, D.;Baltes, H.;Brand, Oliver;Brand, O.: CMOS Cantilever Sensor Systems: Atomic-Force Microscopy and Gas Sensing Applications (Microtechnology and MEMS) (ISBN: 9783540431435) 2002, in Englisch, Broschiert.Nur diese Ausgabe anzeigen…
65%: H. Baltes/ O. Brand/ D. Lange: CMOS Cantilever Sensor Systems (ISBN: 9783642077289) Springer Berlin Heidelberg, in Deutsch.Nur diese Ausgabe anzeigen…
CMOS Cantilever Sensor Systems - 12 Angebote vergleichen
| Preise | 2017 | 2018 | 2019 | 2023 |
|---|---|---|---|---|
| Schnitt | Fr. 118.89 (€ 121.61)¹ | Fr. 119.67 (€ 122.41)¹ | Fr. 91.00 (€ 93.09)¹ | Fr. 91.66 (€ 93.77)¹ |
| Nachfrage |
1
CMOS Cantilever Sensor Systems: Atomic-Force Microscopy and Gas Sensing Applications
DE HC NWISBN: 9783540431435 bzw. 3540431438, in Deutsch, Springer, gebundenes Buch, neu.
Von Händler/Antiquariat, BuySomeBooks [52360437], Las Vegas, NV, U.S.A.
Hardcover. 143 pages. Dimensions: 9.1in. x 6.2in. x 0.6in.This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN.
Hardcover. 143 pages. Dimensions: 9.1in. x 6.2in. x 0.6in.This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN.
2
Cantilever-Based CMOS Sensor Systems
DE HC NWISBN: 9783540431435 bzw. 3540431438, in Deutsch, Springer, gebundenes Buch, neu.
Von Händler/Antiquariat, BuySomeBooks [52360437], Las Vegas, NV, U.S.A.
Hardcover. 143 pages. Dimensions: 9.1in. x 6.2in. x 0.6in.This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN.
Hardcover. 143 pages. Dimensions: 9.1in. x 6.2in. x 0.6in.This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN.
3
CMOS Cantilever Sensor Systems: Atomic-force Microscopy and Gas Sensing Applications (Hardback) (2002)
DE HC NW RPISBN: 9783540431435 bzw. 3540431438, in Deutsch, Springer-Verlag Berlin and Heidelberg GmbH Co. KG, Germany, gebundenes Buch, neu, Nachdruck.
Von Händler/Antiquariat, The Book Depository EURO [60485773], London, United Kingdom.
Language: English Brand New Book ***** Print on Demand *****.This book is intended for scientists and engineers in the field of micro- and nano- electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys- ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona- tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms.
Language: English Brand New Book ***** Print on Demand *****.This book is intended for scientists and engineers in the field of micro- and nano- electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys- ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona- tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms.
4
CMOS Cantilever Sensor Systems
~EN HC NWISBN: 9783540431435 bzw. 3540431438, vermutlich in Englisch, Springer Nature, gebundenes Buch, neu.
Lieferung aus: Deutschland, Lagernd, zzgl. Versandkosten.
This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. Hard cover.
This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. Hard cover.
5
CMOS Cantilever Sensor Systems
~EN NW EB DLISBN: 9783662050606 bzw. 3662050609, vermutlich in Englisch, Springer Shop, neu, E-Book, elektronischer Download.
Lieferung aus: Schweiz, Lagernd, zzgl. Versandkosten.
This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. eBook.
This book is intended for scientists and engineers in the field of micro- and nano electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. eBook.
6
CMOS Cantilever Sensor Systems - Atomic Force Microscopy and Gas Sensing Applications
~EN NW EB DLISBN: 9783662050606 bzw. 3662050609, vermutlich in Englisch, Springer Berlin Heidelberg, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, Versandkostenfrei.
CMOS Cantilever Sensor Systems: This book is intended for scientists and engineers in the field of micro- and nano- electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys- ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona- tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. Englisch, Ebook.
CMOS Cantilever Sensor Systems: This book is intended for scientists and engineers in the field of micro- and nano- electro-mechanical systems (MEMS and NEMS) and introduces the development of cantilever-based sensor systems using CMOS-compatible micromachining from the design concepts and simulations to the prototype. It is also a useful resource for researchers on cantilever sensors and resonant sensors in general The reader will become familiar with the potential of the combination of two technological approaches: IC fabrication technology, notably CMOS technology, and silicon micromachining and the resulting microstructures such as cantilever beams. It was recognized early that these two technologies should be merged in order to make the microstructures smart and devise integrated microsystems with on-chip driving and signal conditioning circuitry - now known as CMOS MEMS or, with the arrival of nanostructures, CMOS NEMS. One way to achieve the merger is the post-processing micro- or nano- machining of finished CMOS wafers, some of which is described in this book. The book introduces this approach based on work carried out at the Physical Electronics Laboratory of ETH Zurich on arrays of cantilever transducers with on-chip driving and signal conditioning circuitry. These cantilevers are familiar from Scanning Probe Microscopy (SPM) and allow the sensitive detection of phys- ical quantities such as forces and mass changes. The book is divided into three parts. First, general aspects of cantilever resona- tors are introduced, e. g. their resonant behavior and possible driving and sensing mechanisms. Englisch, Ebook.
8
CMOS Cantilever Sensor Systems (2013)
EN NW EB DLISBN: 9783662050606 bzw. 3662050609, in Englisch, Springer, Springer, Springer, neu, E-Book, elektronischer Download.
Lieferung aus: Kanada, in-stock.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
9
CMOS Cantilever Sensor Systems
DE NW EBISBN: 9783662050606 bzw. 3662050609, in Deutsch, Springer Berlin Heidelberg, neu, E-Book.
Lieferung aus: Deutschland, Versandkostenfrei, In stock (Download).
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Lade…