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100%: David A. Dornfeld, Jianfeng Luo: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication (ISBN: 9783662079287) 2013, Springer Berlin Heidelberg, 2004. Ausgabe, in Englisch, Taschenbuch.Nur diese Ausgabe anzeigen…
100%: Dornfeld, David A.;Luo, Jianfeng: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales (ISBN: 9783540223696) 2004, Erstausgabe, in Deutsch, Broschiert.Nur diese Ausgabe anzeigen…
90%: Jianfeng Luo, Colaborador: David A. Dornfeld: Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales (ISBN: 9783642061158) in Deutsch, Taschenbuch.Nur diese Ausgabe anzeigen…
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
~EN NW EB DLISBN: 9783662079287 bzw. 3662079283, vermutlich in Englisch, Springer Shop, neu, E-Book, elektronischer Download.
Lieferung aus: Schweiz, Lagernd, zzgl. Versandkosten.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process. eBook.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process. eBook.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales (2013)
EN NW EB DLISBN: 9783662079287 bzw. 3662079283, in Englisch, 311 Seiten, 2004. Ausgabe, Springer, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, E-Book zum Download, Versandkostenfrei.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process. Kindle Edition, Ausgabe: 2004, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2013-03-09, Freigegeben: 2013-03-09, Studio: Springer.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process. Kindle Edition, Ausgabe: 2004, Format: Kindle eBook, Label: Springer, Springer, Produktgruppe: eBooks, Publiziert: 2013-03-09, Freigegeben: 2013-03-09, Studio: Springer.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication - From Particle Scale to Feature, Die and Wafer Scales
~EN NW EB DLISBN: 9783662079287 bzw. 3662079283, vermutlich in Englisch, Springer Berlin Heidelberg, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, Versandkostenfrei.
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod- els which have not kept pace with the tremendous expansion of applications of CMP. Preston`s equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "e integrated model"e and, more specifically, we include the important role of the mechanical elements of the process. Englisch, Ebook.
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod- els which have not kept pace with the tremendous expansion of applications of CMP. Preston`s equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "e integrated model"e and, more specifically, we include the important role of the mechanical elements of the process. Englisch, Ebook.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
~EN PB NWISBN: 9783662079287 bzw. 3662079283, vermutlich in Englisch, Taschenbuch, neu.
Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication ab 205.49 € als pdf eBook: From Particle Scale to Feature, Die and Wafer Scales. Aus dem Bereich: eBooks, Belletristik, Erzählungen,.
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Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales
DE HC NWISBN: 9783540223696 bzw. 354022369X, in Deutsch, Springer, gebundenes Buch, neu.
Von Händler/Antiquariat, IBestBargains [60610469], Houston, TX, U.S.A.
354022369X Brand New US Edition Book in Perfect Condition.Fast Shipping with tracking number.
354022369X Brand New US Edition Book in Perfect Condition.Fast Shipping with tracking number.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
~EN NW EB DLISBN: 9783662079287 bzw. 3662079283, vermutlich in Englisch, neu, E-Book, elektronischer Download.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
DE HC NWISBN: 9783540223696 bzw. 354022369X, in Deutsch, Springer, Berlin, gebundenes Buch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
DE HC NWISBN: 9783540223696 bzw. 354022369X, in Deutsch, Springer, Berlin, gebundenes Buch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
buecher.de GmbH & Co. KG, [1].
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
DE PB NWISBN: 9783642061158 bzw. 364206115X, in Deutsch, Springer-Verlag Berlin and Heidelberg GmbH & Co. K, Taschenbuch, neu.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
DE PB NWISBN: 9783642061158 bzw. 364206115X, in Deutsch, Springer, Berlin, Taschenbuch, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
buecher.de GmbH & Co. KG, [1].
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
buecher.de GmbH & Co. KG, [1].
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