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100%: Qingke Zhang: Investigations on Microstructure and Mechanical Properties of the Cu Pb-free Solder Joint Interfaces (ISBN: 9783662488232) in Englisch, Taschenbuch.Nur diese Ausgabe anzeigen…
80%: Zhang, Qingke: Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces 2016 (Springer Theses) (ISBN: 9783662488218) 2015, Springer-Verlag Berlin and Heidelberg GmbH Co. KG, Germany, in Deutsch, Broschiert.Nur diese Ausgabe anzeigen…
Investigations on Microstructure and Mechanical Properties of the Cu Pb-free Solder Joint Interfaces
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| Preise | 2015 | 2018 | 2019 |
|---|---|---|---|
| Schnitt | Fr. 102.38 (€ 104.69)¹ | Fr. 87.34 (€ 89.31)¹ | Fr. 86.29 (€ 88.24)¹ |
| Nachfrage |
1
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
DE NW EB DLISBN: 9783662488232 bzw. 366248823X, in Deutsch, Springer Shop, neu, E-Book, elektronischer Download.
Lieferung aus: Vereinigte Staaten von Amerika, Lagernd, zzgl. Versandkosten.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. eBook.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. eBook.
2
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
DE NW EB DLISBN: 9783662488232 bzw. 366248823X, in Deutsch, Springer Berlin, neu, E-Book, elektronischer Download.
Lieferung aus: Deutschland, Versandkostenfrei.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces: This thesispresents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. Englisch, Ebook.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces: This thesispresents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. Englisch, Ebook.
3
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (2015)
EN NW EB DLISBN: 9783662488232 bzw. 366248823X, in Englisch, Springer, Springer, Springer, neu, E-Book, elektronischer Download.
Lieferung aus: Australien, in-stock.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced.
4
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (2016)
DE PB NWISBN: 9783662488232 bzw. 366248823X, in Deutsch, Springer Berlin Heidelberg, Taschenbuch, neu.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ab 103.49 € als pdf eBook: Springer Theses. 1st ed. 2016. Aus dem Bereich: eBooks, Fachthemen & Wissenschaft, Wissenschaften allgemein,.
5
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (2016)
DE NW EB DLISBN: 9783662488232 bzw. 366248823X, in Deutsch, neu, E-Book, elektronischer Download.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ab 103.49 EURO Springer Theses. 1st ed. 2016.
6
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
~EN NW EB DLISBN: 9783662488232 bzw. 366248823X, vermutlich in Englisch, neu, E-Book, elektronischer Download.
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces ab 103.49 EURO.
8
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-Free Solder Joint Interfaces 2016 (Hardback) (2015)
DE HC NWISBN: 9783662488218 bzw. 3662488213, in Deutsch, Springer-Verlag Berlin and Heidelberg GmbH Co. KG, Germany, gebundenes Buch, neu.
Von Händler/Antiquariat, The Book Depository EURO [60485773], London, United Kingdom.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
9
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Joint Interfaces (2015)
DE NWISBN: 9783662488218 bzw. 3662488213, in Deutsch, Springer-Verlag Gmbh Nov 2015, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Von Händler/Antiquariat, Rheinberg-Buch [53870650], Bergisch Gladbach, Germany.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Von Händler/Antiquariat, Rheinberg-Buch [53870650], Bergisch Gladbach, Germany.
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
10
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Joint Interfaces (2015)
DE NWISBN: 9783662488218 bzw. 3662488213, in Deutsch, Springer-Verlag GmbH, neu.
Lieferung aus: Deutschland, Versandkostenfrei.
Sparbuchladen, [3602074].
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
Sparbuchladen, [3602074].
Die Beschreibung dieses Angebotes ist von geringer Qualität oder in einer Fremdsprache. Trotzdem anzeigen
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